YASDA offers linear guide stages that combine precision and rigidity.
In the rapidly advancing semiconductor field of 2.5D/3D packaging, high alignment accuracy is required in the process of bonding chips together. In this context, YASDA meets these requirements by manufacturing stages that combine “sub-micron accuracy” and “rigidity” in the development of equipment for advanced processes. Linear guide ways avoid the pulsation that occurs with static pressure guide ways, and YASDA’s outstanding assembly technology achieves low waving, high repeatability, and stable positioning. YASDA’s linear guide stages are suitable for equipment which are excellent for bonding and inspection processes where air slides are not perfectly suited for handling heavy loads. These need to be stable under conditions like high loads and high temperature.